Silicone-based gap fillers with outstanding thermal conductivity of > 1.5 W/m K, low Shore hardness, good long-term thermal endurance, and excellent processability at very high dispensing speeds. 

Silicone-free gap fillers with a thermal conductivity of > 1.0 W/m K and a high level of elasticity. 

Silicone casting systems with high thermal conductivity of up to 1.7 W/m K, low Shore hardness, high long-term thermal endurance, and low mix viscosity.

Polyurethane resins in thermal class B with heat resistance up to 130°C, flame retardancy to UL 94 V0, impressive thermal conductivity as high as 1.1 W/m K, and very good thermal shock resistance.

Polyurethane resins in thermal class F with heat resistance up to 155°C, flame retardancy to UL 94 V0, and thermal conductivity of up to 1.5 W/m K.

Epoxy resins in thermal class H with heat resistance up to 180°C, good thermal shock resistance, and excellent resistance to chemicals.