Silicone (RAKU^® SIL)

Chemical reaction

• One or two components
• Polyaddition and polycondensation reaction
• Minimal exothermic reaction
• Cures at room temperature
• Curing can be accelerated using heat
• Curing without by-products possible (polyaddition reaction)
• Low shrinkage pressure on cast components
• Low sensitivity to moisture
• Hydrophobic

Area of application

• Wide temperature range: -60 to +200 °C, short-term: +250 °C
• Optimum physical properties, virtually constant over the entire application temperature range

Properties

• Very good resistance to temperature fluctuations
• High crack resistance
• Excellent chemical resistance for extreme environments
• Low water absorption
• High water vapor permeability
• Impressive UV and weather resistance
• Tg: always < 0 °C

Adhesion

• Good adhesion to mineral substrates
• Adhesion to other substrates often only with pre-treatment

Flame retardancy

• Can be adapted to UL 94 V0

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