Epoxy (RAKU^® POX)

Chemical reaction

• One or two components (1C or 2C)
• Homopolymerization (1C) and polyaddition reaction (2C)
• Cures at room temperature
• Curing can be accelerated using heat
• Heat curing required for one-component and hot-curing epoxy
• Good impregnation properties
• Low sensitivity to moisture

Area of application

• Temperature range: -40 to +180 °C, short-term: +200 °C

Properties

• High thermal dimensional stability
• Low coefficient of thermal expansion
• High dielectric strength
• High media resistance to fuels
• Low water absorption and water vapor permeability
• Tg: -20 to +180 °C
• OBJS2-listed

Adhesion

• Good adhesion to metals

Flame retardancy

• Can be adapted to UL 94 V0

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