High-Performance Board and Liquid Materials for First-Class Modeling Products
RAMPF Group, Inc. is presenting its encompassing range of model, mold, and tool engineering materials for the automotive, marine, and aviation industries at CAMX 2019 from September 23 - 26 in Anaheim, CA – Booth P4.
The company based in Wixom, MI, develops customized solutions that are tailored to meet the specific requirements of customers throughout the entire production chain – from prototyping, model, mold, and tool construction to production. New in the portfolio are liquid resin systems for structural and interior aerospace composites applications.
The product highlights include:
This brand new board has an extremely fine surface structure, which significantly reduces both finishing and the amount of sealer that has to be used. The surface finish can be transferred from the master model to the prepreg mold, so that no re-sanding of the mold is required and the service life of the prepreg molds is significantly increased. RAKU® TOOL WB-0890 is easy and quick to machine and compatible with all industry-standard paints, release agents, and epoxy prepregs. Tg is 110 °C.
This epoxy board can be bonded in various shapes and sizes. A special RAKU® TOOL adhesive matched in hardness and color is available. RAKU® TOOL WB-0950 is heat resistant up to 200 °C, has a closed surface structure, and exhibits excellent machinability and good dimensional stability. The board is used, amongst others, for the manufacture of lay-up tools for prepregs and vacuum forming molds.
Close Contour Pastes are 2-component epoxy systems that are applied to a close contour substructure by hand or using a CNC machine. Many kinds of supporting structures can be used, including RAKU® TOOL SB-0080 styling board, EPS, and cast aluminum. RAKU® TOOL CP-6131 is easy to process and apply. The production process is fast and efficient – direct tooling does not require the production of a model, and the close contour shape facilitates faster milling times. Furthermore, as with all close contour products, less material is used and less waste produced.
With this resin system, RAMPF has developed a product to match the performance of toughened high Tg prepreg epoxy systems for vacuum infusion and RTM processing. RAKU® EI-2510 has a very low viscosity (200 mPas @40 °C) to allow for low-cost infrastructure and tooling while having an excellent pot life of 2 hrs and a short cure time (2 hrs @120 °C). Fully cured, the system has a dry Tg of 210 °C and excellent hot-wet properties. The system is designed for high fracture toughness and an excellent candidate for applications that are exposed to a harsh environment and high mechanical, thermal, and vibrational loading. Applications include cascades, control surfaces, and structural components.
This unfilled epoxy system combines excellent FST properties with the strength and performance of a toughened epoxy system. Its low viscosity and a temperature-activated cure profile allow for fast cycle times (full cure can be achieved within 15 min). The system is ideal for higher-volume aerospace components like seats (structural and non-structural), pack boards, wall and ceiling panels, overhead bins, and lavatory components.