Close ×

EUROPE

KOREA

NORTH AMERICA

RAMPF thinks globally and acts locally Please select the region and your language via the button
Glossary

Epoxy board material for prepreg lay-up tools

Epoxy board material is characterized, in particular, by its high heat distortion temperature and low coefficient of thermal expansion. This makes it well suited for use as a prepreg lay-up tool and for applications within a higher temperature range of up to 140°C.